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BINDT Insight Cover - Jan 2017

January 9, 2017


Hi-Spec Systems will be featured on January’s front cover showing the innovative new iProbePA®. During the last 50 years, since ultrasonic testing was first introduced, equipment has gradually evolved as computing power has improved. However, the introduction of the iProbePA is recognised as one of the most innovative products ever produced in ultrasonics. By incorporating a complete digital phased array solution in a probe, it now enables an unlimited number of applications to utilise this technology, due to its physical size and impressive performance. Removing the need for a heavy, bulky and expensive instrument has allowed Hi-Spec Systems to significantly reduce the cost of phased array ultrasonic testing (PAUT) and enables PAUT to become mainstream, which was the initial concept of the iProbePA.

The major improvement in PAUT has coincided with the ‘Big Data’ and Internet of Things (IoT) revolution. is data revolution will significantly improve asset management with the aim of improving productivity and so reducing costs. e iProbePA is ideally placed to assist in this process, with the collecting and managing of sensor data.

e data revolution is the biggest change to take place in the NDT industry for decades, with the potential growth in the industry enormous. As we start 2017, this is great news for everyone involved in NDT.



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